ABB IEPAS02 INFI 90 Series

The ABB IEPAS02, also cataloged as the IEPAS02 Modular AC-DC Power Supply, operates as a dedicated hardware component for primary power conversion within Bailey INFI 90 and Net 90 distributed control systems (DCS).

Hardware Specifications

Industrial Control and Drive Hardware

The power supply architecture utilizes an embedded backplane bus connection infrastructure to distribute low-voltage DC currents to adjacent processing modules. The internal switching network drives multi-rail regulation lines over deterministic network backplanes, limiting ripples to protect high-density I/O arrays. Localized EMI filtering components isolate line-side high-frequency harmonics before they can reach the primary control processors, maintaining voltage stability and sustaining clean logic levels during heavy grid fluctuations.

Frequently Asked Questions

Q: How is the IEPAS02 power supply configured for live N+1 power redundancy layouts?

A: The module internal diode decoupling circuits permit parallel connection across a shared backplane, allowing automated load-sharing and instant isolation of a single failed unit without dropping multi-rail DC logic power.

Q: Is this power module rated for insertion while the system rack is actively energized?

A: Yes, the mechanical and electrical contact layouts support hot-swappable replacement, meaning a degraded module can be removed and a new unit plugged directly into a live subrack without power interruption.

Field Installation Guidelines

Slide the power module frame smoothly along the designated chassis guide slots, pressing firmly to fully lock the primary rear pins into the system backplane assembly. Before applying input line voltage, verify that the internal voltage selection jumpers match the local 120 VAC or 240 VAC mains supply constraints. Ensure all incoming AC supply connections and earth ground wires terminate cleanly at the designated terminal blocks to satisfy safety isolation boundaries. Maintain a 50 mm clear perimeter envelope above and below the module housing to allow natural convection airflow currents to escape freely from the chassis vents.