Siemens 6DD2920-0AA0 SIMADYN D Bus Coupler Module

The Siemens 6DD2920-0AA0, also cataloged as the SIMADYN D TS12 Bus Coupler Module, operates as a dedicated hardware component for backplane bus coupling and module synchronization within SIMADYN D system racks.

Hardware Specifications

Backplane Bus Communication Velocity and Signal Routing

The hardware establishes a direct physical bridge across dual 16-bit high-performance backplane buses to maintain deterministic communication lines between adjacent subrack sectors. This structure preserves native backplane bus communication velocity and clock distribution layers without introducing firmware-induced routing penalties. By maintaining hardware-level electrical buffering, the coupler secures parallel data access times across independent computational tasks running on multi-processor configurations.

Frequently Asked Questions

Q: Can the 6DD2920-0AA0 module be inserted into the subrack under active electrical load?

A: No. Hot-swapping the bus coupler module is strictly prohibited. The total subrack power supply assembly must be fully deactivated before physical insertion or extraction to prevent signal line contention and voltage transients on the 16-bit backplane links.

Q: Does the module require separate software node configuration parameters within the STEP 7 CFC framework?

A: No. The 6DD2920-0AA0 operates strictly as a hardware layer pass-through interface component. It does not contain an independent runtime microcode application block, though proper bus mapping must be validated inside the host hardware catalog.

Field Installation Guidelines

• Subrack Alignment: Slide the card into the designated backplane interconnect slot using the integrated guide rails, ensuring complete pin engagement with the rack motherboard backplane receiver.
• Chassis Electrical Bond: Torque the front faceplate retention fasteners directly to the metallic rack frame to establish structural earth ground tracking for high-frequency signal protection.
• Convection Clearance: Verify that adjacent slot positions conform to standard thermal clearance tolerances to maintain ambient operational temperatures below the +55 deg C maximum envelope.