The XG-50 Liquid Flux Solder Paste is a high-performance soldering material designed for precision electronics work. It uses a Sn63/Pb37 alloy and is ideal for BGA rework, SMT soldering, and chip-level repairs in mobile phones, computers, and digital devices.

Its fine particle size (25–45µm) and consistent viscosity allow smooth application and strong bonding, even on complex PCB layouts. With a low melting point of 183°C, it ensures efficient heat transfer and reliable solder joints during high-precision operations.

Key Features:

• Model: XG-50 Solder Paste
• Alloy Composition: Sn63/Pb37 (63% Tin / 37% Lead)
• Micron Size: 25–45µm
• Melting Point: 183°C
• Weight: 35g
• Size: 31mm (diameter) x 38mm (height)
• Application: BGA soldering, SMT assembly, chip repair, and reballing
• Packaging: Airtight container for extended shelf life

Ideal For:

• Mobile phone motherboard repair
• BGA/SMT reflow soldering
• High-precision PCB soldering
• Laptop, console, and computer service industries

Storage Tips:
Store in a cool, dry place or refrigerate for extended shelf life. Allow to return to room temperature before use.